IEC 62769-4 Ed. 3.0 b:2023

Posted on: 08/16/202308/29/2023
Posted by: admin
Posted in: IEC

This part of IEC 62769 specifies the FDI®1 Packages. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure.

Product Details

Edition:: 3.0
Published:: 04/01/2023
ISBN(s):: 9782832267943
Number of Pages:: 186
File Size:: 1 file , 3 MB
Note:: This product is unavailable in Ukraine, Russia, Belarus

IEC 63171-7 Ed. 1.0 en:2023

Connectors for electrical and electronic equipment – Part 7: Detail specification for up to 7 ways including PE or FE (data/power) and shield pin, free and fixed circular connectors for balanced single-pair data transmission with current-carrying capacity – Mechanical mating information, pin assignment and additional requirements for type 7
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