IEC 61189-5-3 Ed. 1.0 b:2015

Posted on: 09/12/202012/20/2019
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Posted in: IEC

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IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering.

Product Details

Edition:: 1.0
Published:: 01/08/2015
Number of Pages:: 79
File Size:: 1 file , 1.3 MB

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