Click here to purchase IEC 62951-3:2018(E) specifies the method for evaluating thin film transistor characteristics on flexible substrates under bulging. The thin film transistor is fabricated on flexible substrates, including polyethylene terephthalate (PET), polyimide (PI), elastomer and others. The stress is applied by applying a uniformly-distributed pressure to the flexible substrate using the equipment.
Connectors for electrical and electronic equipment – Part 7: Detail specification for up to 7 ways including PE or FE (data/power) and shield pin, free and fixed circular connectors for balanced single-pair data transmission with current-carrying capacity – Mechanical mating information, pin assignment and additional requirements for type 7 standard by International Electrotechnical Commission, 05/01/2023
Electric welding equipment – Assessment of restrictions related to human exposure to electromagnetic fields (0 Hz to 300 Hz) – Part 3: Resistance welding equipment standard by International Electrotechnical Commission,